Structalit-701

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 701 is a two part, thermal curing epoxy adhesive. Structalit® 701 appears amber and transparent in thin layers. Structalit® 701 has good bonding to a wide range of materials including metals (alumina, steel and stainless steel) and many plastics. It provides good application behavior, long pot life and short curing time.
Structalit® 701 has met the requirements for USP Class VI and ISO 10993-5.

Structalit® 701 is temperature resistant up to 200 °C and has shown excellent moisture and chemical resistance which makes it suitable for sterilization methods including autoclaving, EtO and gamma irradiation.

Structalit-8801

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 8801 is a universal one-component epoxy adhesive which can also be used as a potting compound. The mean viscosity setting allows a wide range of applications. Structalit® 8801 is characterized by short curing time at low temperatures. Processing temperatures should be above 20°C to simplify the application. Structalit® 8801 has a very good oil resistance and is qualified for applications in the automotive industry. Structalit® 8801 has met the requirements for ISO 10993-5 and is suitable for use in the assembly of disposable medical devices.

Structalit-5893

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 5893 is a thermal curable one-component epoxy-based adhesive with fast curing at low temperature. Structalit® 5893 is characterized by good shock resistance. Structalit® 5893 contains fillers which can sediment, the product has to be homogenized before processing. Structalit® 5893 has met the requirements for ISO 10993-5 and is suitable for use in the assembly of disposable medical devices.

Structalit-8838

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 8838 is a one part heat curing black epoxy, primarily designed for encapsulating components on a printed circuit board (PCB). When cured, it provides a flexible encapsulation to the electronic components and shows stable electronic performance in temperature/humidity testing. Structalit® 8838 is designed to be jet dispensable and it’s shear thinning behavior allows for improved flow control and targeted deposition on specific components. It’s low halogen content keeps the electronic part away from corrosion. Good compatibility with flux residue ensures a good and complete curing on the electronic components. The cured adhesive is also compatible with reflow process.

Structalit-5800

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 5800 is a universal two-component epoxy adhesive which is also used as a potting compound. Depending on the application area, Structalit® 5800 can be cured thermally or at room temperature.

Structalit-5820

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 5820 is a universal one-component epoxy adhesive. The mean viscosity setting allows a wide range of applications. Structalit® 5820 is particularly suitable for the bonding of materials with similar thermal expansion coefficients, metal/metal, glass/glass or plastic/plastic. Structalit® 5820 is transparent after curing. Structalit® 5820 tends to crystallize during storage. The process is reversible after 1 hour at 40 ° C in the oven.

Structalit-3060

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 3060 is a one-component non-conductive die attach epoxy-based adhesive with high flexibility and very short curing times. No more than 0.4 g of adhesive may be cured at a time. Structalit® 3060 has a high ionic purity of <10ppm.

Structalit-5604

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 5604 is a thermal curing, one component SMD adhesive, showing fast curing properties at low temperatures. The SMD adhesive shows a solid shock behavior. The material can be applied by using common industrial techniques: dispensers, screenprint, needle transfer. It is recommended to cure not more than 0,4g adhesive at once.

The product can be used as SMD adhesive for soldering temperatures in short processes (max. 5 minutes) at temperatures up to 270° C.

Structalit-5610

Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 5610 is a thermal curable one-component SMD adhesive with extremely fast curing at low temperatures. Structalit® 5610 adhesive is characterized by good shock resistance. The application is easily possible with dispenser, screen printing or via needle transfer. Structalit® 5610 can be used as a SMD adhesive for soldering temperatures (max. 5 min.) up to 270 ° C. No more than 2 g of adhesive may be cured at a time.