Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 5604 is a thermal curing, one component SMD adhesive, showing fast curing properties at low temperatures. The SMD adhesive shows a solid shock behavior. The material can be applied by using common industrial techniques: dispensers, screenprint, needle transfer. It is recommended to cure not more than 0,4g adhesive at once.

The product can be used as SMD adhesive for soldering temperatures in short processes (max. 5 minutes) at temperatures up to 270° C.