Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.

Structalit® 5610 is a thermal curable one-component SMD adhesive with extremely fast curing at low temperatures. Structalit® 5610 adhesive is characterized by good shock resistance. The application is easily possible with dispenser, screen printing or via needle transfer. Structalit® 5610 can be used as a SMD adhesive for soldering temperatures (max. 5 min.) up to 270 ° C. No more than 2 g of adhesive may be cured at a time.