Panacol Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. Structalit® products are designed for bonding, casting and protecting components in electronic and automotive industry.
Structalit® 8838 is a one part heat curing black epoxy, primarily designed for encapsulating components on a printed circuit board (PCB). When cured, it provides a flexible encapsulation to the electronic components and shows stable electronic performance in temperature/humidity testing. Structalit® 8838 is designed to be jet dispensable and it’s shear thinning behavior allows for improved flow control and targeted deposition on specific components. It’s low halogen content keeps the electronic part away from corrosion. Good compatibility with flux residue ensures a good and complete curing on the electronic components. The cured adhesive is also compatible with reflow process.